Application Period : 1 June – 8 July 2022
Final : 19 August 2022




Contest Goal
Bridging together innovative technologies and enterprises
Timeline



Artificial Intelligence & Big Data

Smart Living, Mobility and Healthcare

Fintech

New Materials

Biomedicine & Biotechnology

Internet of Things

Industrial Internet & Advanced Manufacturing

New Generation Information Technology


Digital Entertainment & eSports Software
Potential field of use and market growth of the underlying technology of the project
Technological or business innovativeness of the project and intellectual property protection measures that have been planned or in place
Academic qualifications, work experience, entrepreneurial experience and technical background of the project team
Business model feasibility and responsiveness to market developments of the project
Finalists will receive the following additional rewards
Opportunity for direct admission to the City University HK Tech 300 Seed Fund Programme (Subject to fulfill the relevant requirements, see here for more details )
Free participation in Hong Kong Trade Development Council’s International ICT Expo 2022 to be held in October this year tentatively
# Subject to availability
* The reward provider reserves the right of final decision, and the reward is also subject to the relevant terms and conditions.
Contest Briefing cum
Sharing of 2021’s Winning Project Teams
“Bring Innovation and Technology’s Strengths into Full Play for integration into the National Development” Sharing Session
Hong Kong Chapter Final
cum Award Presentation Ceremony (19 August 2022)